MANUFACTURER: SAMSUNG

PART NUMBER: M395T5750CZ4-CE60

MODULE CONFIGURATION: 4/8 BYTE DIMM

DATA BIT: X72 240 PIN FULLY BUFFERED DIMM

DRAM COMPONENT TYPE: DDR2 SDRAM (1.8V VDD)

DEPTH: 256M

BANKS: 4 BANKS, SSTL(1.8V), 64MS/ 8K (7.8US)

BIT ORGANIZATION: X4

PACKAGE: FBGA (LEAD-FREE)

TEMP AND POWER: COMMERCIAL TEMP, NORMAL POWER

SPEED: DDR2-667 (333MHZ @ CL = 5, TRCD = 5, TRP = 5